Irvine, California, June 22, 2022: Telit, a global enabler of the Internet of Things (IoT), today announced it was broadening its IoT connectivity portfolio with the introduction of ‘Telit NExT Embedded’.
Employing next generation integrated SIM (iSIM) and embedded SIM chip (eSIM) technology in the cellular IoT module with an array of intuitive, easy-to-use connection, and device management tools, Telit NExT Embedded will materially simplify deployment of cellular connected IoT devices at any scale, said the company.
Without the need for a SIM tray or any extra components on the device side, this comprehensive, scalable management resource for IT and IoT managers in the back office allows IoT adopters to innovate faster — with more security and less complexity during device design and throughout deployment operations.
Complementing the offering, Telit is introducing a line of embedded SIM modules with the ME310G1 — the first LTE-M module to be equipped with the leading-edge ultra-miniature cellular SIM chip technology. Together, the two technology options — integrated and embedded SIM — allow developers and providers to deploy cellular connected products anywhere on the globe out-of-the box.
Telit offers a portfolio of embedded connectivity options designed to enable IoT businesses to:
- Design devices with/without a SIM socket or a SIM chip
- Leverage form factor families with modules to support different cellular technologies and regions
- Innovate with the latest SIM chip on module options and full eUICC compliance
- Work with Telit NExT profiles for major tier-one MNOs globally
- Expand deployments with iSIM in sync with global carrier plans to support standards
- Excel in operational efficiency with over-the-air (OTA) and eUICC-aligned management tools and resources that meet flexibility, simplicity, scalability and security needs now — and that also future-proof the deployment
Image credit: Telit