Silicon Labs has introduced its latest IoT solution, known as the “Series 3” platform, which boasts an impressive advancement: a remarkable 100-fold enhancement in performance tailored for on-device machine learning (ML) and artificial intelligence (AI) workloads.
This new iteration, the Series 3, is positioned to succeed its predecessor, the Series 2, and employs a 22nm process node to deliver an array of benefits encompassing performance, efficiency, and scalability. The standout feature within this array is the company’s assertion that the Series 3 components will usher in a processing capability increase exceeding 100 times. This augmentation will be driven by accelerators dedicated to on-device machine learning and AI projects, although the specific metrics and benchmarks substantiating this claim are yet to be unveiled by the company.
Notably, the third-generation IoT platform will present a comprehensive range of radio connectivity alternatives, as affirmed by Silicon Labs. These alternatives will encompass Bluetooth Low Energy (BLE), Wi-Fi, Wi-SUN, IEEE 802.15.4, and proprietary protocols, all harmonized under a unified code base. Furthermore, the company underscores enhancements exclusive to proprietary aspects related to power management, which are poised to significantly elongate the operational lifespan of devices by conserving power at critical junctures.