Qualcomm announces world’s “most power-efficient NB2 IoT chipset”

Listen to the attributes of Qualcomm’s new IoT chipset

Global wireless tech company Qualcomm Technologies today announced the introduction of what it called “a breakthrough new product” to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

The company said in a press release that the new chipset required less than one micro-amp of sleep current. The Qualcomm 212 LTE IoT Modem’s cutting-edge power-efficient chipset architecture allows for extremely low average power consumption.

It supports a wide range of batteries and longer life span of the device in the field, and combines ultra-low system-level cut-off voltage with provisions for adapting power usage according to varying source power levels, thus allowing end devices with power supply levels as low as 2.2 volts.

“The Qualcomm 212 LTE IoT Modem will help usher in a new era for a range of IoT applications around the globe, especially those requiring connectivity deep within buildings combined with low power use, like battery-powered IoT devices that need to operate for 15 years or longer in the field,” said Vieri Vanghi, Vice President, Product Management, Qualcomm Europe, in the press release. “Its ultra-low power consumption, compact form factor, and low cost will greatly benefit OEMs creating the next generation of low-power IoT devices.”

The new chipset modem supports single-mode 3GPP Release 14 Cat. NB2 IoT connectivity, anticipated to enable extended coverage for delay tolerant applications on RF frequency bands spanning from 700MHz to 2.1GHz for Global roaming.

It is housed in a compact single-chip solution, including modem baseband, application processor, memory, RF transceiver with fully integrated RF front end, and power management units, and enables LTE modules below 100 square millimeters in size. Its high level of integration with few external components not only results in a low-cost Bill of Materials, but also facilitates quicker module design enabling faster commercialization time for OEMs, claimed Qualcomm.

Image credit: Qualcomm

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