Irvine, California, Dec. 9, 2015: Semiconductor solutions company Broadcom Corporation has introduced a new family of enhanced low-power (ELP) chipset that will soon drive wearables, smart homes and other kinds of Internet of Things (IoT) gadgets.
The company said in a release that it was releasing the multi-protocol Bluetooth/802.15.4 combo systems-on-a-chip (SoCs) into its Wireless Internet Connectivity for Embedded Devices (WICED) portfolio. Devices based on the latter provide original equipment manufacturers (OEMs) with a platform for low-power IoT products and applications.
The WICED CORE ELP Bluetooth family delivers advanced technology for a wide range of IoT applications, including simultaneous multi-protocol support, the industry’s first 40nm flash memory in a communications SoC, low-power consumption and a common development platform. By integrating a host of features including increased processor speed, FPU and DSP libraries, more applications RAM and significant flash memory on a chip the size of a fingernail, Broadcom enables OEMs to create more complex applications and employ a wireless MCU that scales across a much wider product set than solutions available today.
Said Brian Bedrosian, Broadcom Senior Director, Product Marketing, Wireless Connectivity, “In addition to enabling multi-protocol support, we support more complex IoT applications for OEMs and developers, all while consolidating our low-power solution in a small package.”
Image Credit: Broadcom Corp.